SK Hynix unpacks 'HBM4E' - Next-Generation DRAM for AI
Memory giant, SK Hynix, June 17, 2026 said it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers
Seoul (South Korea): Memory giant, SK Hynix, June 17, 2026 said it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.
"The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM," said SK Hynix.
"We will work closely with partners for mass production in a timely manner", it added.
HBM4E Features
The 12-layer HBM4E shows improvements in both performance and power efficiency. It features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models.
"These enhancements improve data processing capabilities for AI training and inference", the company said.
The HBM4E reduces data transfer latency through its latest interface and design optimization while maintaining stable operation in high-bandwidth environments.
"This enables customers to increase efficiency in processing data for AI data centers and large-scale computing systems", it said.
Advanced MR-MUF1 Technology
SK hynix utilizes Advanced MR-MUF1 technology for HBM4E products to achieve a 48 GB capacity in a 12-layer stack while ensuring structural stability.
"In particular, the company has improved heat resistance by 17%, compared to the preceding HBM4, enabling stable operation of memory chips in high-performance computing environments", SK Hynix said.
Mass Reflow Molded Underfill
Mass Reflow Molded Underfill (1MR-MUF) is the process used for stacking semiconductors by injecting liquid protective materials between chips to protect circuits.
SK hynix has successfully supplied optimized memory solutions to customers based on its expertise in the mass production and supply of HBM3, HBM3E, and HBM4.
Leveraging its market-proven product reliability and supply capabilities, the company will support the development of next-generation infrastructure while helping address AI system bottlenecks.
"SK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise," said Ahn Hyun, President and Chief Development Officer.
"Through close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator", he added.
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